Publications

3D


2015

  • Yu Wang, Song Yao, Shuai Tao, Xiaoming Chen, Yuchun Ma, Yiyu Shi, Huazhong Yang, HS3DPG: Hierarchical Simulation for 3D P/G Network , in IEEE Transactions on Very Large Scale Integration Systems (TVLSI), vol.23, No.10, 2015, pp.2307-2311. pdf
  • Wulong Liu, Yu Wang, Guoqing Chen, Yuchun Ma, Yuan Xie, Huazhong Yang, Whitespace-Aware TSV Arrangement in 3-D Clock Tree Synthesis , in IEEE Transactions on Very Large Scale Integration Systems (TVLSI), vol.23, No.9, 2015, pp.1842 - 1853. pdf

2014

  • Wulong Liu, Yu Wang, Yuchun Ma, Yuan Xie, Huazhong Yang, On-chip hybrid power supply system for wireless sensor nodes , in ACM Journal on Emerging Technologies in Computing Systems (JETC), vol.10, No.3, 2014, pp.23:1-23:22. pdf
  • Wulong Liu, Yu Wang, Yu Wang, Xue Feng, Yuan Xie, Yidong Huang, Huazhong Yang, Exploration of Electrical and Novel Optical Chip-to-Chip Interconnects , in IEEE Design & Test, vol.31, No.5, 2014, pp.28-35. pdf
  • Wulong Liu, Guoqing Chen, Xue Han, Yu Wang, Yuan Xe, Huazhong Yang, Design methodologies for 3D mixed signal integrated circuits: A practical 12-bit SAR ADC design case , in Proceedings of the 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 2014, pp.166:1-166:6. pdf
  • Song Yao, Xiaoming Chen, Yu Wang, Yuchun Ma, Yuan Xie, Huazhong Yang, Efficient region-aware P/G TSV planning for 3D ICs , in Proceedings of the 15th International Symposium on Quality Electronic Design (ISQED), 2014, pp.171-178. pdf

2013

  • Shuai Tao, Xiaoming Chen, Yu Wang, Yuchun Ma, Yiyu Shi, Hui Wang, Huazhong Yang, HS3DPG: Hierarchical simulation for 3D P/G network , in Proceedings of the 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 2013, pp.509-514. pdf
  • Wulong Liu, Haixiao Du, Yu Wang, Yuchun Ma, Yuan Xie, Jinguo Quan, Huazhong Yang, TSV-aware topology generation for 3D clock tree synthesis , in Proceeding of the 14th International Symposium on Quality Electronic Design (ISQED), 2013, pp.300-307. pdf
  • Xin Li, Wulong Liu, Haixiao Du, Yu Wang, Yuchun Ma, Huazhong Yang, Whitespace-aware TSV arrangement in 3D clock tree synthesis , in Proceeding of the IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2013, pp.115-120. pdf
  • Qingyu Liu, Yuchun Ma, Yu Wang, Wayne Luk, Jinian Bian, RALP: Reconvergence-aware layer partitioning for 3D FPGAs. , in Proceeding of the International Conference on Reconfigurable Computing and FPGAs (ReConFig), 2013, pp.1-6. pdf
  • Wulong Liu, Tao Zhang, Xue Han, Yu Wang, Yuan Xie, Huazhong Yang, Design Methodologies for 3D Mixed Signal Integrated Circuits: a Practical 8-bit SAR ADC Design Case , in 51st ACM/EDAC/IEEE Design Automation Conference (DAC) Work-in-Progress (WIP), 2013. pdf

2012

  • Jing Xie, Yu Wang, Yuan Xie, Yield-aware time-efficient testing and self-fixing design for TSV-based 3D ICs , in Proceedings of the 17th Asia and South Pacific Design Automation Conference (ASP-DAC), 2012, pp.738-743. pdf
  • Zuowei Li, Yuchun Ma, Qiang Zhou, Yici Cai, Yu Wang, Tingting Huang, Yuan Xie, Thermal-aware power network design for ir drop reduction in 3d ics , in Proceedings of the 17th Asia and South Pacific Design Automation Conference (ASP-DAC), 2012, pp.47-52. pdf

2011

  • Kan Wang, Sheqin Dong, Yuchun Ma, Yu Wang, Xianlong Hong, Jason Cong, Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs , in IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences (IEICE), vol.94, No.12, 2011, pp.2490-2498. pdf
  • Kan Wang, Yuchun Ma, Sheqin Dong, Yu Wang, Xianlong Hong, Jason Cong, Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs , in Proceedings of the 16th Asia and South Pacific Design Automation Conference (ASP-DAC), 2011, pp.261-266. pdf
  • Wulong Liu, Yu Wang, Wei Liu, Yuchun Ma, Yuan Xie, Huazhong Yang, On-chip Hybrid Power Supply System for Wireless Sensor Nodes , in Proceedings of the 16th Asia and South Pacific Design Automation Conference (ASP-DAC), 2011, pp.43-48. pdf
  • Shouchun Tao, Jia Liu, Yuchun Ma, Zhigang He, Ning Xu, Yu Wang, Xianlong Hong, An ILP algorithm for voltage-island generation considering temperature in 3D-Ics , in Proceddings of the International Conference on Electric Information and Control Engineering (ICEICE), 2011, pp.3950-3953. pdf

2010

  • Paul Falkenstern, Yuan Xie, Yao-Wen Chang, Yu Wang, Three-dimensional integrated circuits (3D IC) floorplan and power/ground network co-synthesis , in Proceedings of the 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 2010, pp.169-174. pdf
  • Shuai Tao, Yu Wang, Jiang Xu, Yuchun Ma, Yuan Xie, Huazhong Yang, Simulation and analysis of P/G noise in TSV based 3D MPSoC , in Proceedings of the International Conference on Green Circuits and Systems (ICGCS), 2010, pp.573-577. pdf
  • Yuchun Ma, Kan Wang, Sheqin Dong, Yu Wang, Xianlong Hong, Thermal effects of leakage power in 3D ICs , in Proceedings of the International Conference on Green Circuits and Systems (ICGCS), 2010, pp.578-583. pdf

2009

  • Yuchun Ma, Xin Li, Yu Wang, Xianlong Hong, Thermal-aware incremental floorplanning for 3D ICs based on MILP formulation , in IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences , vol.92, No.12, 2009, pp.2979-2989.
  • Balaji Vaidyanathan, Yu Wang, Yuan Xie, Cost-aware lifetime yield analysis of heterogeneous 3D on-chip cache , in Proceedings of the IEEE International Workshop on Memory Technolog (MTDT), 2009, pp.65-70. pdf

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